J. Bruck, Caltech, USA
S. Budkowski, INT, France
B. Ciciani, University of Roma, Italy
F. Cristian, U.C. San Diego, USA
A. Goyal, IBM Watson Research Center, USA
J. Hauser, Sun Microsystems, USA
J. Hayes, University of Michigan, Ann Arbor, USA
R. Horst, Tandem Computers Inc., USA
M. Karpovsky, Boston University, USA
H. Levendel, Lucent Tech., Bell Labs Innovations, USA
Q. Li, Santa Clara University, CA, USA
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F. Lombardi, Texas A&M, USA
E. Maehle, University of Lubeck, Germany
K. Makki, University of Nevada, Las Vegas, USA
M. Malek, Humboldt University, Germany
A. Nordsieck, Boeing, USA
N. Pissinou, CACS, USE, USA
M. Raynal, IRISA, France
R. Riter, Boeing, USA
K. Siu, MIT, USA
B. Smith, IBM Watson Research Center, USA
K. Trivedi, Duke University, USA
J. Wu, University of Florida, USA
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